They uniquely combine high-precision optical alignment capability with epoxy-based attachment, eutectic die bonding and/or laser soldering for all optical elements, waveguides, fiber types and die, chip or PIC hybridization tasks – all in an industry-proven design. Since its original founding in 2001, ficonTEC has become the market leader for individually customized solutions for semi or fully automated micro-assembly and testing of opto-electronic components, micro-optic assemblies and photonics-enabled devices. Our machines employ industry-proven production. We offer a full line of fiber optic couplers and splitters supporting SM, MM, PM, large core, and double-clad fibers across 300–2000 nm, with power handling up to 100 W and operating temperatures up to 300°C. Three fabrication methods are employed: fusion, micro-optics, and planar lightwave circuit. SmarAct optical assembly solutions deliver cutting-edge technology for the alignment, positioning, and integration of optical components with nanometer accuracy. With nanometer-level accuracy and incremental step size capabilities, these modular, direct-drive nanopositioning solutions enable high-precision alignment for your optical device test and assembly processes at speeds necessary to s c systems. This automated subsystem for wafer probing with high throughput presents an approach for fiber array alignment and other photonics test and packaging processes combining hexapod 6-axis motion platforms, gantries and fast alignment algorithms. PI provides a variety of innovative active optical.